Universal Laser Systems stands at the forefront of laser engraving, cutting, and marking technology, showcasing decades of expertise and a commitment to research and development in their laser material processing systems. Our laser cutting and engraving machines deliver the exceptional precision, performance, and reliability you anticipate from premium laser products. They come equipped with several exclusive 'Uniquely Universal' features—patented innovations aimed at boosting the efficiency, productivity, and profitability of laser processing. These distinctive offerings are available solely from Universal Laser Systems, and we take pride in being one of their dedicated suppliers!
Our Lasers
The VLS2.30DT is a compact and cost-effective platform designed as an entry-level laser machine for launching your laser material processing business. It is ideal for prototype development and on-demand production, and it also serves as an efficient second machine for managing production overflow. With a material processing envelope of 406x305x102mm (12,585 cm³), the VLS2.30DT can be equipped with either a 10 or 30-watt laser cartridge.
Standard features include Laser Interface+™, with various additional options available to enhance your laser processing capabilities. All Universal laser platforms utilize interchangeable components, allowing you to customize your system to meet your specific needs.
The VLS3.60DT desktop model is compact enough to fit on any workspace while being powerful enough for on-demand production needs. Commonly used in educational settings, it’s also an excellent option for launching your laser business. With a material processing area of 610x305x102 mm (18,878 cm³), the VLS3.60DT can be outfitted with one of five ULS laser cartridges, offering power options from 10 to 60 watts.
Standard features include Laser Interface+™, with various additional options available to enhance your laser processing capabilities. All Universal laser platforms utilize interchangeable components, allowing you to customize your system to meet your specific requirements.
The VLS3.75 is a versatile, free-standing platform that serves as an excellent entry point for light-duty manufacturing. It is widely used in educational institutions globally for programs in architecture, product and graphic design, and materials research. This single laser platform provides a selection of six laser cartridges with options ranging from 10 to 75 watts, and it features a material processing envelope of 610x305x229mm, totaling 42,475 cm³.
The VLS3.75 comes equipped with Standard Uniquely Universal features such as Laser Interface+™ and Rapid Reconfiguration™, along with various additional options to enhance your laser processing capabilities. All Universal laser platforms utilise interchangeable components, allowing you to customize your system to meet your specific needs.
Universal's VLS4.75 is a free-standing platform offering a spacious work area and the ability to quickly adjust laser power with our patented Rapid Reconfiguration. Designed and engineered for light manufacturing and prototyping, the VLS4.75 is a single laser platform that offers a choice of six laser cartridges ranging in power from 10-75 watts.
The VLS4.75 offers a material processing envelope of 610x457x229mm, 63,713 cm³. Laser Interface+™ and Rapid Reconfiguration™ are Uniquely Universal features that come standard on the VLS4.75, and a number of additional options are available to enhance your laser processing capabilities. All Universal laser platforms use interchangeable components, giving you the ability to tailor your system to fit your needs.
The largest in the VLS platform line, the VLS6.75 has a wide and deep engraving area that can accommodate a variety of materials. The VLS6.75 offers a choice of six laser cartridges ranging in power from 10-75 watts. The material processing envelope of 810x457x229mm, 84,950 cm³ makes the VLS6.75 a versatile laser engraving solution for most award and sign shops.
In addition to the basic capabilities of the machine, there are a number of patented Uniquely Universal features that are only available from Universal Laser Systems. Laser Interface+™ and Rapid Reconfiguration™ are Uniquely Universal features that come standard on the VLS6.75, and a number of additional options are available to enhance your laser processing capabilities. All Universal laser platforms use interchangeable components, giving you the ability to tailor your system to fit your needs.
The ULTRA X6000 platform offers laser material processing for the widest possible range of materials. It is designed and ideally suited for precision material processing in manufacturing, research and development, academic research, and prototyping environments. With its unique modular architecture, customizable solutions can be easily reconfigured with a wide array of options for enhancing performance, capability, and safety to complete the perfect solution to meet present and future business needs.
The ULTRA X6000 platform has a materials processing envelope of 36 x 24 in (914 x 610 mm), with support for materials with a thickness up to 12 in (305 mm).
Configure the customizable ULTRA X6000 platform with up to three laser sources consisting of two interchangeable CO2 lasers and one fiber laser. When the platform is configured with three lasers, users can take full advantage of MultiWave Hybrid™ technology enabling up to three wavelengths – 9.3 µm, 10.6 µm, and 1.06 µm – to be simultaneously combined into a single coaxial beam. Each spectral component of the beam is independently controlled and can be modulated in real time.
Major features include multiple laser support, rapid high-accuracy laser beam positioning, precision material-independent autofocus, controllable laser power density, an automation interface, camera registration, an integrated touch screen control panel, over temperature detection, and support for fire suppression.
The ULTRA R5000 platform offers laser material processing for a wide range of materials. It is designed and ideally suited for material processing in manufacturing, research and development, academic research, and prototyping environments. With its unique modular architecture, customizable solutions can be easily reconfigured with a wide array of options for enhancing performance, capability, and safety to complete the perfect solution to meet present and future business needs.
The ULTRA R5000 platform has a materials processing envelope of 32 x 24 in (813 x 610 mm), with support for materials with a thickness up to 12 in (305 mm).
Configure the customizable ULTRA R5000 platform with up to two laser sources consisting of two interchangeable CO2 lasers or one CO2 laser and one fiber laser. When the platform is configured with two lasers users can take advantage of MultiWave Hybrid™ technology enabling up to two of three wavelengths from 9.3 µm, 10.6 µm, and 1.06 µm – to be simultaneously combined into a single coaxial beam. Each spectral component of the beam is independently controlled and can be modulated in real time.
Major features and options include multiple laser support, rapid laser beam positioning, precision material-independent autofocus, controllable laser power density, automation interface, multi-camera vision & registration, over temperature detection, and support for fire suppression.
The ULTRA R9000 platform offers laser material processing for a wide range of materials. It is designed and ideally suited for material processing in manufacturing, research and development, academic research, and prototyping environments. With its unique modular architecture, customizable solutions can be easily reconfigured with a wide array of options for enhancing performance, capability, and safety to complete the perfect solution to meet present and future business needs.
The ULTRA R9000 platform has a materials processing envelope of 48 x 24 in (1219 x 610 mm), with support for materials with a thickness up to 12 in (305 mm).
Configure the customizable ULTRA R9000 platform with up to two laser sources consisting of two interchangeable CO2 lasers or one CO2 laser and one fiber laser. When the platform is configured with two lasers users can take advantage of MultiWave Hybrid™ technology enabling up to two of three wavelengths from 9.3 µm, 10.6 µm, and 1.06 µm – to be simultaneously combined into a single coaxial beam. Each spectral component of the beam is independently controlled and can be modulated in real time.
Major features and options include multiple laser support, rapid laser beam positioning, precision material-independent autofocus, controllable laser power density, automation interface, multi-camera vision & registration, over temperature detection, and support for fire suppression.
One Touch Laser are proud to offer the entire range from Universal Laser Systems. Please Contact Us for more information.